Product Overview
Copper Electroplating Chemicals used for TSV
Attributable to excellent performance in via depths coverage, our products address demands from consumer-grade, industrial-grade, and automotive-grade applications. Moreover, we uniquely fulfill ultra-deep via filling requirements for high-power scenarios, establishing ourselves as the sole domestic supplier capable of stable mass production for TSV copper plating with via depths exceeding 400µm or aspect ratios surpassing 15:1, outperforming conventional 10:1 industry thresholds in CoWoS packaging.
Cooperation Hotline
+86-0755-2736 7080
Welcome to call our cooperation hotline.
Contact us
Tel：+86-0755-2736 7080
E-mail：market@czcgkj.com
Add：C2802, Block BC,Union R&D Center,Longteng Community,Xixiang Subdistrict,Bao’an District Shenzhen, Guangdong PRC
© 2024 Shenzhen Chuangzhi Semi-link Technology Co., Ltd. All Rights Reserved| 粤ICP备15057394号
