Product Overview
Copper Electroplating Chemicals used for Cu-Pillar
Our copper electroplating chemicals utilize proprietary additives to reduce residual stress in plated Cu-pillar, ensuring precise control over wafer warpage during copper deposition. Combined with our advance process technologies that deliver exceptional high-current stability.
Cooperation Hotline
+86-0755-2736 7080
Welcome to call our cooperation hotline.
Contact us
Tel：+86-0755-2736 7080
E-mail：market@czcgkj.com
Add：C2802, Block BC,Union R&D Center,Longteng Community,Xixiang Subdistrict,Bao’an District Shenzhen, Guangdong PRC
© 2024 Shenzhen Chuangzhi Semi-link Technology Co., Ltd. All Rights Reserved| 粤ICP备15057394号
